Automatic Inspection Device for Wafer Chip Appearance
Achieving high-precision inspection with high-resolution, clear images.
Automatic inspection device for wafer chip appearance capable of expanding upper inspection.
- Company:英光産業
- Price:Other
1~6 item / All 6 items
Achieving high-precision inspection with high-resolution, clear images.
Automatic inspection device for wafer chip appearance capable of expanding upper inspection.
Automatic inspection of all inspection items for wire bonding.
This is an introduction to the automatic appearance inspection device for wire bonding used in power modules, handled by Eiko Sangyo Co., Ltd.
X-ray imaging enables a complete inspection after taping! Achieving automatic inspection with clear images.
The "Taping X-ray Automatic Inspection Device" is a machine that sets the reel after taping and performs internal crack inspection through X-ray fluoroscopy and internal inspection after molding. The optimal equipment configuration is selected according to the inspection target products, inspection items, and inspection accuracy. Automation of existing X-ray inspection devices and customization according to application is possible. 【Features】 - Achieves automatic inspection of all molded product interiors - Capable of automatic inspection for internal cracks within embossed tape - Realizes automatic inspection using clear images with diagonal fluoroscopy and accumulated images - Customization support including the transport system For more details, please contact us or download the catalog.
A rich lineup of various lithium-ion batteries, including inline machines!
High-speed inspection is possible through parallel processing enabled by a fast transport system and the addition of tubes and detectors, along with judgment software using grayscale images. It can accommodate various types of lithium-ion batteries, including cylindrical, prismatic, polymer, EV-type stacked cell, and jelly roll types. Additionally, we offer a wide range of offline models, such as "semi-auto machines" and "CT & 3D machines." For more details, please contact us or download the catalog.
Automatically attach low-adhesion NG seals to defective areas.
Automatic visual inspection device for film printing that conducts comprehensive appearance inspections for printing omissions (defects), dirt adhesion, and printing position misalignment by comparing with standard images.
Reduction of defective product outflow through full X-ray automatic inspection, enabling labor saving! Detection of internal cracks and voids in chips, inspection of wire bending and peeling.
【Features】 ■ Full Automatic Inspection Capable of full automatic inspection of the interior and internal cracks of molded products. ■ Inspection Speed High-speed inspection at 200 pcs/min. ■ Customization Support Optimal equipment configuration according to the inspected products, inspection items, and inspection accuracy. Customization is possible, including the transport system. Automation and customization of existing X-ray inspection equipment according to applications are also supported.